Comparative Thermal and Thermomechanical Analyses of Traditional and Flip Chip Double-Sided Cooling Power Module
| Autor: | Guoliao Sun, Cheng Peng, Huapeng Chen, Wenhui Zhu, Liancheng Wang |
|---|---|
| Rok vydání: | 2022 |
| Zdroj: | 2022 23rd International Conference on Electronic Packaging Technology (ICEPT). |
| DOI: | 10.1109/icept56209.2022.9873117 |
| Databáze: | OpenAIRE |
| Externí odkaz: |
|