Detecting a trojan die in 3D stacked integrated circuits
| Autor: | Kundan Nepal, Jennifer Dworak, Ping Gui, Alfred L. Crouch, Soha Alhelaly, Theodore W. Manikas |
|---|---|
| Rok vydání: | 2017 |
| Předmět: |
Engineering
business.industry Electrical engineering Delay analysis 020206 networking & telecommunications 02 engineering and technology Integrated circuit Die (integrated circuit) 020202 computer hardware & architecture law.invention Stack (abstract data type) Trojan law 0202 electrical engineering electronic engineering information engineering business |
| Zdroj: | NATW |
| Popis: | While 3D integrated circuits provide many security advantages, one disadvantage is the insertion of a Trojan die into the stack. In this paper, we explore a technique to detect an extra die through delay analysis. |
| Databáze: | OpenAIRE |
| Externí odkaz: |
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