Online monitoring of thermoset post-curing by dynamic mechanical thermal analysis DMTA

Autor: H. Bayerl, Harald Goering, U. Michel, Wolfgang Stark
Rok vydání: 2009
Předmět:
Zdroj: Polymer Testing. 28:561-566
ISSN: 0142-9418
DOI: 10.1016/j.polymertesting.2009.02.005
Popis: Thermosetting moulding compounds are synthetic materials which can be easily formed in the molten state and achieve high temperature stability due to a cross-linking process which takes place during manufacture. To ensure thermal and mechanical properties, post-curing of moulded phenolic resin components is necessary for high quality applications. In the industrial practice, post-curing time–temperature-programs are heuristically acquired. In this paper, dynamical mechanical thermal analysis is employed to determine optimal post-curing conditions for injection moulded parts from phenolic resin.
Databáze: OpenAIRE