CHAMPS (chemical-mechanical planarization simulator)

Autor:	Kwang-Jae Yoo, Kyung-Hyun Kim, Jeong-Taek Kong, Bo-Yeon Yoon, Young-Kwan Park, Sang-Rok Ha, Yoo-Hyon Kim
Rok vydání:	2002
Předmět:	Computer Science::Hardware Architecture Work (thermodynamics) Engineering business.industry Chemical-mechanical planarization Process (computing) Polishing Integrated circuit design Chip business Planarity testing Simulation Process conditions
Zdroj:	2000 International Conference on Simulation Semiconductor Processes and Devices (Cat. No.00TH8502).
Popis:	Simulation of chemical-mechanical polishing is important because the chip-level planarity and wafer-level uniformity dependent on many dynamic factors are difficult to control. CHAMPS (chemical mechanical planarization simulator) has been developed for predicting and optimizing the thickness distribution after the CMP process using the chip level pattern density and an elastic spring model including equipment parameters. In this work, the results of CMP simulation are shown to agree well with the measured data. This simulator can be used to optimize CMP process conditions and to generate design rules for filling dummy patterns which are used to improve planarity and uniformity.
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::6c7c9a85433aa4476e92ab0067c468c6 https://doi.org/10.1109/sispad.2000.871223 Zobrazit plný text záznamu