Using LTCC for microsystems
| Autor: | Heiko Thust, Torsten Thelemann, Michael Hintz |
|---|---|
| Rok vydání: | 2002 |
| Předmět: |
Materials science
Micropump Mechanical engineering Condensed Matter Physics USable Pressure sensor Atomic and Molecular Physics and Optics Surfaces Coatings and Films Electronic Optical and Magnetic Materials law.invention Planar law Microsystem Electrical network Component (UML) Electronic engineering Electrical and Electronic Engineering Microfabrication |
| Zdroj: | Microelectronics International. 19:19-23 |
| ISSN: | 1356-5362 |
| Popis: | A characteristic feature of LTCC is good workability. In some cases a LTCC‐based microsystem can be a good alternative to microsystems made in silicon or other technologies. Reasons for choosing LTCC‐Technology may be financial considerations or specific material properties. A main problem is to simplify a mechanical component in such a way, that it is possible to integrate this component in a planar structure with a small height in consideration of the restrictions of the LTCC‐Technology. In contrast to LTCC‐based substrates with only electrical circuits the integration of mechanical components make other demands on the different technological steps of the LTCC‐Process. In this paper some 3D‐structures made in LTCC‐like fluidic channels, membranes usable for micropumps or pressure sensors – and some aspects of required special technological demands are described. |
| Databáze: | OpenAIRE |
| Externí odkaz: |
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