Development of ultra fine wire for fine pitch bonding

Autor:	T. Yamashita, Y. Ohno, Y. Iguchi, Y. Arao, Kanamori Takashi, Y. Ohzeki
Rok vydání:	2002
Předmět:	Wire bonding Materials science Lead bonding business.industry Metallurgy Hardware_INTEGRATEDCIRCUITS Optoelectronics Fine pitch Head (vessel) Ultra fine business Gold alloys
Zdroj:	1991 Proceedings 41st Electronic Components & Technology Conference.
DOI:	10.1109/ectc.1991.163926
Popis:	The development of a 40- mu m pitch wire bonding technology for use in development of a 600 DPI LED print head is discussed. To accomplish this, a high-strength super-fine Au-base wire with a diameter of 10 mu m was developed, and a suitable wire bonding technology using that wire was determined. A 600 DPI LED technology was experimentally manufactured, and it showed good results in reliability tests. >
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::6c46e2981945e6a081ccec37f2cacace https://doi.org/10.1109/ectc.1991.163926 Zobrazit plný text záznamu