Metal oxide semiconductor 3D printing: preparation of copper(ii ) oxide by fused deposition modelling for multi-functional semiconducting applications
| Autor: | Rat Prathumwan, Kittitat Subannajui, Jedsada Junpha, Ahamad Salea |
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| Rok vydání: | 2017 |
| Předmět: |
Materials science
Absorption spectroscopy Composite number Sintering 02 engineering and technology 010402 general chemistry 01 natural sciences Copper(II) oxide law.invention chemistry.chemical_compound Van der Pauw method law Materials Chemistry Ceramic Composite material Fused deposition modeling business.industry Metallurgy General Chemistry 021001 nanoscience & nanotechnology 0104 chemical sciences Semiconductor chemistry visual_art visual_art.visual_art_medium 0210 nano-technology business |
| Zdroj: | Journal of Materials Chemistry C. 5:4614-4620 |
| ISSN: | 2050-7534 2050-7526 |
| Popis: | A CuO semiconductor was successfully prepared by fused deposition modeling (FDM) and sintering technique. A 1.75 mm high-loading Cu composite was extruded and printed into a desired size and shape. The sample was sintered and calcined to transform Cu powder to CuO semiconductor. The 3-dimensional (3D) printed CuO had a scaffold structure with a half density of bulk CuO. It had a mechanical characteristic like a scaffold ceramic although prepared by FDM machine. van der Pauw measurement and UV-visible absorption spectroscopy were used to determine the electrical and optical properties of the 3D printed CuO respectively. The 3D printed CuO was used as an example of a 3D semiconductor which has a response to light, pressure, and temperature. This technique has a potential to be applied in any FDM machine which might allow anyone to print semiconductor or other related materials. |
| Databáze: | OpenAIRE |
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