| Popis: |
Three-dimension ICs (3D-ICs) are the current trend due to their improvement in heterogeneous integration, performance, power consumption, silicon area, and form factors. However, the consequent new challenges are interconnects between dies, i.e., Through-Silicon-Vias (TSVs) and micro-bumps (μ-bumps). Therefore, many interconnect test, diagnosis, and repair schemes were proposed, such as double TSVs & double μ-bumps schemes. In this paper a novel DFT technique is presented based on the double resource schemes. Challenges to two-die, multi-tier, and numerous interconnects are handled by proposed testable, diag-nosable, repairable, and scalable element, structure, and flow. |
