Methodology for Solder-Joint Lifetime Prediction of LED-Based PCB Assemblies
| Autor: | Alessio Griffoni, Geert Willems, Franco Zanon, Bart Vandevelde |
|---|---|
| Rok vydání: | 2018 |
| Předmět: |
Materials science
020208 electrical & electronic engineering Mechanical engineering 02 engineering and technology 01 natural sciences Finite element method Electronic Optical and Magnetic Materials law.invention 010104 statistics & probability law Soldering 0202 electrical engineering electronic engineering information engineering Range (statistics) Computer-aided 0101 mathematics Electrical and Electronic Engineering Reliability design Safety Risk Reliability and Quality Joint (geology) Reliability (statistics) Light-emitting diode |
| Zdroj: | IEEE Transactions on Device and Materials Reliability. 18:377-382 |
| ISSN: | 1558-2574 1530-4388 |
| DOI: | 10.1109/tdmr.2018.2849083 |
| Popis: | A solder-joint crack due to thermal fatigue affects the reliability of light emitting diode assemblies. A new methodology is presented for the solder-joint lifetime estimation under a wide range of working conditions. The proposed method is based on the combination of reliability design of experiments, computer aided structural analysis validated by thermal-cycling experiments, and surface response modeling. |
| Databáze: | OpenAIRE |
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