SPICE simulation used to characterize the cross-talk reduction effect of additional tracks grounded with vias on printed circuit boards
| Autor: | G.I. Costache, D.N. Ladd |
|---|---|
| Rok vydání: | 1992 |
| Předmět: |
Engineering
business.industry Spice Electrical engineering Hardware_PERFORMANCEANDRELIABILITY Classification of discontinuities Crosstalk Printed circuit board Transmission line Signal Processing Hardware_INTEGRATEDCIRCUITS Electronic engineering Skin effect Electrical and Electronic Engineering business Electronic systems Network analysis |
| Zdroj: | IEEE Transactions on Circuits and Systems II: Analog and Digital Signal Processing. 39:342-347 |
| ISSN: | 1057-7130 |
| DOI: | 10.1109/82.145291 |
| Popis: | In analog and digital electronic systems, cross-talk between tracks on a printed circuit board can degrade the performance of equipment operations. A technique based on additional tracks grounded by vias, with which the cross-talk can be reduced by 50-90%, is presented. The circuit analysis code SPICE is used to analyze a lumped-circuit Tee structure model of three coupled lines. The via discontinuities are modeled in a novel way, which accounts for their transient skin-effect resistance. Both the cross-talk model and the cross-talk reduction technique are validated with measured results for signals of 50-1000 MHz, and risetimes of 5 ns. It is also shown how the far-field radiation from the circuit board is reduced with the introduction of additional grounded tracks. > |
| Databáze: | OpenAIRE |
| Externí odkaz: |
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