Electron BackScattered Diffraction (EBSD) use and applications in newest technologies development
| Autor: | S. Courtas, C. Wyon, X. Federspiel, N. Bicaïs-Lepinay, Magali Gregoire |
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| Rok vydání: | 2006 |
| Předmět: |
Diffraction
Materials science business.industry Scanning electron microscope Resolution (electron density) ComputingMethodologies_IMAGEPROCESSINGANDCOMPUTERVISION Condensed Matter Physics Atomic and Molecular Physics and Optics Grain size Surfaces Coatings and Films Electronic Optical and Magnetic Materials Characterization (materials science) Optics Grain boundary Texture (crystalline) Electrical and Electronic Engineering Safety Risk Reliability and Quality business Electron backscatter diffraction |
| Zdroj: | Microelectronics Reliability. 46:1530-1535 |
| ISSN: | 0026-2714 |
| Popis: | Electron BackScattered Diffraction (EBSD) is a Scanning Electron Microscopy (SEM) based technique where diffraction patterns of backscattered electrons are collected on a screen and analyzed. This paper presents how EBSD provides quantitative and local information about metal texture, grain size, grain boundaries and twins. The application of the EBSD technique to copper layers texture characterization at SEM resolution scale shows outstanding results on both full sheet and patterned wafers. It helps process engineers and integration teams to improve devices yield and reliability. |
| Databáze: | OpenAIRE |
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