In-Situ Friction and Pad Topography Measurements During CMP

Autor:	Chris Rogers, Moinpour Monsour, Sriram Anjur, Caprice Gray, Chris E. Barns, Daniel Apone, Vincent P. Manno
Rok vydání:	2004
Předmět:	In situ Materials science law Slurry Wafer Integrated circuit Composite material Rotation Laser-induced fluorescence Uncorrelated Noise (radio) law.invention
Zdroj:	MRS Proceedings. 816
ISSN:	1946-4274 0272-9172
DOI:	10.1557/proc-816-k5.4
Popis:	Duel Emission Laser Induced Fluorescence (DELIF) and friction measurements are taken in-situ during CMP to observe slurry flow beneath a model of an integrated circuit (IC) wafer. Friction measurements average around 7.5 lb and multiple frequencies are observed. Slurry film thicknesses on the order of a 10±3μm were observed during CMP of a flat wafer. The film thickness seems uncorrelated to friction measurements except when the pad and wafer rotation speeds are significantly slowed. DELIF has also accurately measured a 9μm etched step, with noise in the image equal to ±3 μm.
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::6b1d5c70550618649b9c5b7031ceaa20 https://doi.org/10.1557/proc-816-k5.4 Zobrazit plný text záznamu Full text from SpringerLink