RF power LDMOSFET on SOI

Autor: Dimitri A. Antoniadis, J.A. del Alamo, J.G. Fiorenza
Rok vydání: 2001
Předmět:
Zdroj: IEEE Electron Device Letters. 22:139-141
ISSN: 1558-0563
0741-3106
Popis: We have fabricated a SOI laterally diffused MOSFET that is designed for use in radio frequency power amplifiers for wireless system-on-a-chip applications. The device is fabricated on a thin-film SOI wafer using a process that is suitable for integration with SOI CMOS. An under-source body contact is implemented and both a high breakdown voltage and a high f/sub t/ are attained. The device performance compares favorably with bulk silicon rf power MOSFETs. For a gate length of 0.7 /spl mu/m the device f/sub t/ is 14 GHz, f/sub max/ is 18 GHz, and the breakdown voltage approaches 25 V.
Databáze: OpenAIRE