| Popis: |
The manufacture of advanced ceramic components requires high accuracy and repeatibility in the control of the fabrication process. Surface finish in the nanometer range and excellent figure accuracy can be achieved if material can be removed from the surface without causing brittle fracture. To define the mechanism of "ductile" material removal, a series of experiments were initiated involving two processes: single-point diamond turning and diamond-wheel grinding. The results indicate that at small depths of cut, using stiff, well controlled machine tools, ceramic materials like silicon, silicon carbide, and germanium can be machined in a ductile regime. |
