Reliability of integrated resistors and the influence of WLCSP bake
| Autor: | Leo van Marwijk, V. M. Girault, Som Nath, J. Zhang, S. Jose, J. Bisschop |
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| Rok vydání: | 2016 |
| Předmět: |
010302 applied physics
Materials science Physics::Instrumentation and Detectors business.industry Thermal resistance Electrical engineering Physics::Physics Education 02 engineering and technology 021001 nanoscience & nanotechnology 01 natural sciences Temperature measurement Computer Science::Other law.invention Stress (mechanics) Computer Science::Emerging Technologies Reliability (semiconductor) CMOS Chip-scale package law 0103 physical sciences Optoelectronics Wafer Resistor 0210 nano-technology business |
| Zdroj: | 2016 IEEE International Integrated Reliability Workshop (IIRW). |
| DOI: | 10.1109/iirw.2016.7904904 |
| Popis: | This paper presents the long-term stability of integrated CMOS resistors in a 40nm technology node. Unsilicided polysilicon and diffusion resistors with two different geometries were investigated. The thermal stability of the resistors was studied at different stress temperatures. Some resistors were subjected to the critical bake temperature in the WLCSP (Wafer Level Chip Scale Packaging) assembly process. The resistance shifts were measured at different stress temperatures after the bake. It was found that WLCSP thermal budget has a significant influence on the resistor shift characteristics in the case of p-poly resistors. |
| Databáze: | OpenAIRE |
| Externí odkaz: |
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