| Popis: |
In mask manufacturing, resist coating is one of the most important processes for fine pattern making because the pattern CD uniformity largely depends on the resist film accuracy. In recent years, various spin coating methods, we have found that the rotary cup method is the best choice to meet our requirements. The method has various advantages in comparison with the other ones. On the other hand, there is a problem of film thickness variations, which are specific to certain types of resist, with this method. In our study, we established a new coating technique which solved the problem mentioned above, without sacrificing the advantages of the rotary cup method. This new method is very effective for resist coating and can be applied to mask fabrication for the next generation devices including 230 mm masks. |
