The effect of annealing temperature on flexural strength, dielectric loss and thermal conductivity of Si3N4 ceramics
| Autor: | Yongfeng Xia, Weide Wang, Huanbei Chen, Hanqin Liang, Yu-Ping Zeng, Kaihui Zuo, Xing Yu, Dongxu Yao, Jinwei Yin |
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| Rok vydání: | 2020 |
| Předmět: |
Materials science
Annealing (metallurgy) Mechanical Engineering Metals and Alloys Sintering 02 engineering and technology Dielectric 010402 general chemistry 021001 nanoscience & nanotechnology Hot pressing 01 natural sciences 0104 chemical sciences Thermal conductivity Flexural strength Mechanics of Materials Materials Chemistry Dielectric loss Grain boundary Composite material 0210 nano-technology |
| Zdroj: | Journal of Alloys and Compounds. 813:152203 |
| ISSN: | 0925-8388 |
| Popis: | Effect of annealing temperatures on flexural strength, dielectric and thermal properties of Si3N4 ceramics was investigated with different amounts of Yb2O3 (3.5 mol% and 7 mol%) as sintering additives. High density of >99% were achieved after hot pressing. The post annealing heat treatment promoted the crystallization of the grain boundary glass phase. Low dielectric loss of 75 W/(m·K) and >90 W/(m·K) were obtained in the direction parallel and perpendicular to the hot-pressing direction in all samples, respectively. The low flexural strength of ∼600 MPa may attribute to the large grain in the matrix and lack of elongated abnormal grains. |
| Databáze: | OpenAIRE |
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