Simulation of a high-power LED lamp for the evaluation and design of heat dissipation mechanisms
| Autor: | Fang-Jui Kuo, Yi-Sheng Liao, Heng-Jen Kuo, Ming-Tzer Lin, De-Shau Huang |
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| Rok vydání: | 2015 |
| Předmět: |
Engineering
Fin business.industry 020209 energy Nuclear engineering Electrical engineering 02 engineering and technology Heat sink Condensed Matter Physics Chip Thermal management of high-power LEDs Electronic Optical and Magnetic Materials law.invention LED lamp Hardware and Architecture law Heat generation Heat transfer Thermal 0202 electrical engineering electronic engineering information engineering Electrical and Electronic Engineering business |
| Zdroj: | Microsystem Technologies. 22:523-529 |
| ISSN: | 1432-1858 0946-7076 |
| DOI: | 10.1007/s00542-015-2580-x |
| Popis: | High-power LED lamps have been under intense development in recent years. However, issues related to heat dissipation on the LED chip continue to plague research efforts. Heat generation increases with the power of the LED chip and heat accumulation is exacerbated by the plastic casinge of the lamp. Accumulated heat can seriously shorten the lifespan of an LED device. Consequently, manufacturers are constantly seeking ways to improve heat dissipation via heat transfer mechanisms. Little analysis has been performed on coupling the fluid field and heat dissipation inside LED lamps. Using FLUENT software, this study developed a simulation method for LED lamps in order to investigate thermal and fluid fields inside a lamp. The simulation results of an 8 W LED lamp predicted a chip temperature of 75.1 °C and maximum air velocity of 97.3 mm/s within the lamp with two sets of air circulation. The proposed model facilitates new fin designs and the determination of the optimal inner-shell thickness with the proposed design of a LED lamp having 36 fins and an inner-shell thickness of 1 mm for increased heat dissipation. |
| Databáze: | OpenAIRE |
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