The Influence of a 3D Model of a Radio Electronic Component on Thermal Simulation
| Autor: | A S Kushnarev, A V Bashkirov, I. S. Bobylkin, V V Glotov, Yu.S. Balashov |
|---|---|
| Rok vydání: | 2021 |
| Předmět: | |
| Zdroj: | Journal of Physics: Conference Series. 2096:012052 |
| ISSN: | 1742-6596 1742-6588 |
| DOI: | 10.1088/1742-6596/2096/1/012052 |
| Popis: | Very often, when designing and developing radio electronic devices, engineers are regularly faced with the need to solve various kinds of problems to ensure the operation of a product under the required mechanical loads or thermal conditions during operation. One of the main issues that arise when conducting thermal modeling of radio electronics is the correct assessment of the results. There are a number of electronic components that need to be cooled, mainly through a printed circuit board: power supply transistors, power diodes, microcircuits, etc. For such elements, 90% (or more) of the heat flux from the component is diverted through the printed circuit board, and then to the radiator. Therefore, when carrying out the simulation, it is necessary to have previously obtained reliable temperature results on the power elements. The use of a detailed 3D model for modeling is most often unjustified and can introduce certain errors in the calculations. This article compares different 3D transistor models and the effect of detailing on the modeling process in CAD SolidWorks. |
| Databáze: | OpenAIRE |
| Externí odkaz: |
|