Molecular engineering for future device structures: self-assembled monolayers as diffusion barriers for Cu metallization

Autor:	Zsolt Tokei, Caroline Whelan, F. Clemente, V. Suteliffe, Gerald Beyer, Arantxa Maestre Caro
Rok vydání:	2007
Předmět:	Materials science Molecular level Monolayer Copper interconnect Nanotechnology Self-assembled monolayer Thermal stability Self-assembly Diffusion (business) Molecular engineering
Zdroj:	2007 Digest of papers Microprocesses and Nanotechnology.
DOI:	10.1109/imnc.2007.4456304
Popis:	This paper investigates a selective self-assembly process for formation of a self-assembled monolayers (SAM) barrier to Cu diffusion in dual damascene integration. In selecting a barrier, trichlorosilanes are promising due to their high thermal stability (above 550degC) and dense molecular packing. Overall, this study demonstrates that the tuneable structure and chemistry of SAMs provides a molecular level engineering approach for future device structures.
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::6967481cfed075e07174bf68a1e89b5b https://doi.org/10.1109/imnc.2007.4456304 Zobrazit plný text záznamu