Gel Debonding from a Rigid Substrate
| Autor: | Lorenzo Tapia, Suping Lyu, M. Carme Calderer, Duvan Henao, Carlos A. Garavito |
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| Rok vydání: | 2020 |
| Předmět: |
Strain energy release rate
Physics Deformation (mechanics) Mechanical Engineering Mathematical analysis 02 engineering and technology Critical value 01 natural sciences Aspect ratio (image) 010101 applied mathematics 020303 mechanical engineering & transports 0203 mechanical engineering Mechanics of Materials General Materials Science Calculus of variations Boundary value problem 0101 mathematics Quotient Dimensionless quantity |
| Zdroj: | Journal of Elasticity. 141:51-73 |
| ISSN: | 1573-2681 0374-3535 |
| DOI: | 10.1007/s10659-020-09774-9 |
| Popis: | We consider the problem of debonding of a thin gel domain from a rigid substrate. Starting with a variational approach involving the total energy of a gel, we formulate the boundary value problem of the governing equations in two-space dimensions. We consider the case that the aspect ratio, $\eta $ , the quotient of the thickness of the film with respect to its length, is very small. We assume that the gel is partially debonded at the dimensionless horizontal location denoted by $0 |
| Databáze: | OpenAIRE |
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