| Autor: |
Masatsugu Nimura, Toshihisa Nonaka, Yoichi Shinba, Shuichi Shoji, Jun Mizuno, Masaki Ohyama, Akitsu Shigetou |
| Rok vydání: |
2014 |
| Předmět: |
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| Zdroj: |
2014 4th IEEE International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D). |
| DOI: |
10.1109/ltb-3d.2014.6886187 |
| Popis: |
In this study, we developed 8 μm-pitch microbump bonding and encapsulating by hybrid Cu/Sn-adhesive bonding technology. As an adhesive material, we used a non-conductive film (NCF). To realize simultaneous bonding of a metal and an adhesive, planar structure was formed by chemical mechanical polishing (CMP). After the planarization, hybrid bonding was carried out at 250 °C for 60 s. From scanning electron microscopic (SEM) observation of the bonded sample, it was confirmed that 8 μm-pitch bump bonding and the NCF filling 2.5-μm gap between the chip and substrate were performed at the same time. This result indicated that hybrid bonding was effective in fine-pitch bonding and encapsulating for future three-dimensional (3D) integration. |
| Databáze: |
OpenAIRE |
| Externí odkaz: |
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