Autor:	Chih-Sheng Jao, Wei-Keng Lin, Chih-Ting Yeh, Wen-Hua Zhang, Song-Bor Chiang
Rok vydání:	2019
Předmět:	Fluid Flow and Transfer Processes Silicon oil Materials science Packaging engineering business.industry Mechanical Engineering Thermal resistance Nanotechnology Thermal management of electronic devices and systems Condensed Matter Physics business Encapsulation (networking)
Zdroj:	Heat Transfer Research. 50:349-360
ISSN:	1064-2285
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::68e7c9650c7f8b535338775181403318 https://doi.org/10.1615/heattransres.2018025129 Zobrazit plný text záznamu