The interrelationship between internal stress, processing parameters and microstructure of physically vapour deposited and thermally sprayed coatings
| Autor: | K.T. Scott, G. Eckold, D.S. Rickerby, I.M. Buckley-Golder |
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| Rok vydání: | 1987 |
| Předmět: |
Yield (engineering)
Materials science Metallurgy Metals and Alloys chemistry.chemical_element Surfaces and Interfaces engineering.material Tungsten Microstructure Surfaces Coatings and Films Electronic Optical and Magnetic Materials Coating chemistry Residual stress Materials Chemistry Stress relaxation engineering Spallation Thermal spraying |
| Zdroj: | Thin Solid Films. 154:125-141 |
| ISSN: | 0040-6090 |
| Popis: | Internal stress is an important parameter in coating technology since it often relates to the maximum coating thickness which can be deposited without spallation, and this applies to coatings produced by both physical vapour deposition (PVD) and thermal spraying. For plasma-sprayed coatings in particular a heat transfer model is described which predicts the variation in residual stress distribution as a function of coating thickness and deposition rate and the results are compared with experimental observations. The levels of residual stress in plasma-sprayed tungsten have been measured by X-ray and mechanical slitting methods and explanations as to why these methods yield different results given. For PVD tungsten coatings the most important systems parameter is substrate bias since this allows some stress relaxation to occur via its influence on porosity levels in the coating and the consequences this has on residual stress levels is discussed. In PVD tungsten coatings the internal stress was completely relaxed on dissolution of the substrate, accompanied by a decrease in the lattice parameter of the film. |
| Databáze: | OpenAIRE |
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