A Wafer-on-Wafer Non-Uniform High Power Thermal Model for 3D Chip Package
| Autor: | Song Wang, Xiping Jiang, Fengguo Zuo, Huimei Wang, Xiaofeng Zhou, Jingrui Chai, Yubing Wang, Bin Hou, Liang Zhong, Wenxin Li, Yi Kang |
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| Rok vydání: | 2022 |
| Zdroj: | 2022 China Semiconductor Technology International Conference (CSTIC). |
| DOI: | 10.1109/cstic55103.2022.9856859 |
| Databáze: | OpenAIRE |
| Externí odkaz: |
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