Electrodeposition of Copper-Containing Polymer Coatings from Sulfate Electrolytes Containing N-Methylpyrrolidone

Autor:	I. N. Loskutnikova, A. I. Sokolenko, E. F. Kuznetsova, L. M. Skibina, V. V. Kuznetsov
Rok vydání:	2005
Předmět:	Chemistry Metal ions in aqueous solution Organic Chemistry Inorganic chemistry Metals and Alloys chemistry.chemical_element Electrolyte Copper Dissociation (chemistry) Surfaces Coatings and Films Metal Adsorption visual_art Materials Chemistry visual_art.visual_art_medium Copper plating Molecule
Zdroj:	Protection of Metals. 41:427-430
ISSN:	1608-327X 0033-1732
Popis:	In sulfate electrolytes for copper plating, N-methylpyrrolidone (MP) was found to form stable 2 : 1 complexes with the metal. The nature of electroactive species at the copper cathode depends on the MP concentration. In a concentration range from 10−4 to 10−2 mol/l, the electrode reaction involves complexes of discharging metal ions with adsorbed MP molecules, the complexes being formed in the surface layer. At higher MP concentrations, a slow chemical step associated with dissociation of complex species in the bulk of the solution precedes ion discharge. The inhibitive effect of MP on copper electrodeposition is due to adsorbed MP molecules at the electrode; the adsorption value determines the efficiency of the additive and the wear resistance of the coating.
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::68b7d6d7c18689ef1844b321cb2f60a8 https://doi.org/10.1007/s11124-005-0061-9 Zobrazit plný text záznamu Plný text ve formátu PDF