High throughput two-stage bonding technique for advanced wafer level packaging
| Autor: | B. Oberhofer, T. Sonoda, V. Rangelov, S. Altenbockum |
|---|---|
| Rok vydání: | 2019 |
| Předmět: |
010302 applied physics
Interconnection Materials science business.industry 05 social sciences Hardware_PERFORMANCEANDRELIABILITY Substrate (printing) Chip 01 natural sciences Reliability (semiconductor) 0103 physical sciences Hardware_INTEGRATEDCIRCUITS Optoelectronics 0501 psychology and cognitive sciences Wafer business Throughput (business) Wafer-level packaging Flip chip 050104 developmental & child psychology |
| Zdroj: | 2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC). |
| DOI: | 10.23919/empc44848.2019.8951877 |
| Popis: | Thermo-Sonic Flip Chip Bonding (TS-FCB) is an already established technology for chip on wafer (CoW) applications in the industry. As a very fast and reliable interconnection process [1] it has been chosen for this project to temporarily tack small and medium sized ICs on the substrate. Its individual chip placement allows high yields per substrate. Metallic interconnections with high reliability were formed and characterized using a thermo-compression gang bonding oven with a capability to process substrates with topography [2]. Both techniques together combine high productivity with flexible, reliable, and well known fluxless process providing a new solution to drive the integration towards future needs. |
| Databáze: | OpenAIRE |
| Externí odkaz: |
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