3D Multi-chip Integration and Packaging Technology for NAND Flash Memories

Autor:	Herb Huang, Rino Micheloni
Rok vydání:	2016
Předmět:	Packaging engineering Computer science business.industry NAND gate USB Chip Solid-state drive Flash memory law.invention Wafer fabrication Flash (photography) law Embedded system business
Zdroj:	3D Flash Memories ISBN: 9789401775106 3D Flash Memories
DOI:	10.1007/978-94-017-7512-0_9
Popis:	Small form factors have been one of the main drivers for the success of Flash memory cards, largely in the form of USB stick and Secure Digital, SD. On the other hand, mainly driven by the success of Solid State Drives (SSDs), capacity requirement has grown dramatically to the extent that standard packaging (and design) techniques are no longer able to sustain the pace. In order to solve this issue, two approaches are possible: advanced die stacking and 3D monolithic technologies. This chapter covers the former, while the latter is the main subject of this book.
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::683c318d4804a1780220e29a061702be https://doi.org/10.1007/978-94-017-7512-0_9 Zobrazit plný text záznamu