Design of ICs for flip-chip integration with optoelectronic device arrays
| Autor: | R.E. Oettel, A.V. Krishnamoorthy, R.G. Rozier, R. Farbarik, C.D. Hull, J. Rieve, G.F. Aplin, Fouad Kiamilev |
|---|---|
| Rok vydání: | 2002 |
| Předmět: |
Very-large-scale integration
business.industry Computer science Cmos vlsi circuits Transistor Electrical engineering Integrated circuit layout law.invention Gallium arsenide chemistry.chemical_compound CMOS chemistry law Hardware_INTEGRATEDCIRCUITS Electronic engineering Optoelectronics business Flip chip Electronic circuit |
| Zdroj: | Proceedings 1997 IEEE Multi-Chip Module Conference. |
| DOI: | 10.1109/mcmc.1997.569363 |
| Popis: | Hybrid integration of optoelectronic devices, such as GaAs MQW modulators, to CMOS VLSI circuits provides the opportunity to design ICs that integrate millions of transistors and thousands of high-speed optical I/Os for high-performance computing and switching applications. One of the challenges in designing such large-scale ICs lies in the development of an efficient method for integrating existing VLSI circuit layouts with two-dimensional arrays of optoelectronic devices. This paper presents several such methods and describes their application. |
| Databáze: | OpenAIRE |
| Externí odkaz: |
|