| Autor: |
Jerry Chao-Lee Lin, Vivien Yi-Chun Chen, Der-Juinn Horng, Kuo-Chi Chang, Kai-Chun Chu |
| Rok vydání: |
2018 |
| Předmět: |
|
| Zdroj: |
2018 13th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT). |
| DOI: |
10.1109/impact.2018.8625796 |
| Popis: |
The wafer process disasters is to use inherently safer design (ISD) strategies to take full account of the manufacturing plant is built to eliminate hazards of energy source; disasters and accidents must be greatly reduced. This study used concept of substituted wet bench chemicals from N-396 to replace to DSP.The experimental results due to the 11 batches and replaced of 10nm wafer process, the product yield increased to 85.36% from 83.75%, improvement of electrical characteristics DC (%) from 6.37% to 6.44, improvement of frequency response (%) from 5.27% down to 4.30%, improvement of stripping ability (%) from 4.47% to 4.20%. |
| Databáze: |
OpenAIRE |
| Externí odkaz: |
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