Glue Layer Study of Inter Via between Cu and Al Metal Lines

Autor:	Kevin Chang, John Chen, Linhong Yang, Cheney Qiao
Rok vydání:	2011
Předmět:	Metal Materials science visual_art visual_art.visual_art_medium Composite material GLUE Layer (electronics)
Zdroj:	ECS Transactions. 34:781-785
ISSN:	1938-6737 1938-5862
Popis:	A 0.13um Cu-Al hybrid backend between a dual damascene process with Cu line and a conventional process with Al line is introduced in this paper. First 3 metal layers (M1~M3) interconnects with Cu line for process capability and circuit speed concern. Whereas following metal layers (M4~M7) interconnects with Al line for cost concern. The interconnection via between Cu and Al interface is the key process for Cu-Al hybrid process. This paper mainly focused on via process study between Cu and Al interconnection.
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::673d5c757b4a25164b9e49c4493f93fb https://doi.org/10.1149/1.3567673 Zobrazit plný text záznamu