Mechanical and Curing Properties of a Styrene-based Shape Memory Polymer

Autor:	Richard V. Beblo, Lisa Mauck Weiland, Korey Gross
Rok vydání:	2010
Předmět:	chemistry.chemical_classification Materials science Flexural modulus Mechanical Engineering Modulus Polymer Thermal expansion Shape-memory polymer Creep chemistry Ultimate tensile strength General Materials Science Composite material Curing (chemistry)
Zdroj:	Journal of Intelligent Material Systems and Structures. 21:677-683
ISSN:	1530-8138 1045-389X
Popis:	Presented is an experimental investigation into the characteristics of a particular styrene-based shape memory polymer, Veriflex®. Tensile, 3 point bend, and creep tests are conducted yielding the Young’s modulus, yield strength, flexural modulus, flexure strength, and creep modulus of the polymer both above and below the glass transition temperature. The results of the characterization may be used to populate a linear constitutive model appropriate for design. To populate the constitutive model parameters for viscosity, retardation time, and coefficient of thermal expansion are also developed. Initial experiments in this effort revealed the tendency for residual monomer to remain after curing. While the residual monomer ultimately evaporates from the sample, when present it acts as a plasticizer thereby increasing the glassy state compliance. Thus, also presented are strategies employed for eliminating residual monomer during sample preparation.
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::66f2f2dcbfac04f684b2120107888acd https://doi.org/10.1177/1045389x10364860 Zobrazit plný text záznamu