Power electronics thermal packaging and reliability

Autor:	F. P. McCluskey, A. Bar-Cohen
Rok vydání:	2013
Předmět:	Engineering Reliability (semiconductor) Power rating Transmission (telecommunications) business.industry Power module Power electronics Thermal Electrical engineering High power density business Power (physics)
Zdroj:	2013 IEEE Transportation Electrification Conference and Expo (ITEC).
DOI:	10.1109/itec.2013.6573464
Popis:	Presents the power point presentations from the conference proceedings. Power electronics is the critical enabling technology at the intersection of renewable power generation, reliable power distribution and transmission, and efficient power utilization and storage. Issues of compact and high power density packaging, thermal management and reliability are the most important research areas for realizing the full potential of power electronics.
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::66caa73e2c43329f6db364f259487274 https://doi.org/10.1109/itec.2013.6573464 Zobrazit plný text záznamu