Investigation Into Chemistry and Performance of No-Clean Flux in Fine Pitch Flip-Chip Package

Autor:	M.A. Amalina, Khoo Ly Hoon, Saif Wakeel, A.S.M.A. Haseeb
Rok vydání:	2022
Předmět:	business.industry Optoelectronics Fine pitch Flux Electrical and Electronic Engineering business Industrial and Manufacturing Engineering Flip chip Electronic Optical and Magnetic Materials
Zdroj:	IEEE Transactions on Components, Packaging and Manufacturing Technology. 12:155-167
ISSN:	2156-3985 2156-3950
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::66b14ce757e67787948d2fd59c031832 https://doi.org/10.1109/tcpmt.2021.3109885 Zobrazit plný text záznamu