Polymer Waveguide-coupled Co-packaged Silicon Photonics-die Embedded Package Substrate
| Autor: | Hiroki Yaegashi, Akihiro Noriki, Daisuke Shimura, Koichi Takemura, Takeru Amano, Y. Ibusuki, Satoshi Suda, Akio Ukita, I. Tamai, Takayuki Kurosu, Yosuke Onawa, Tsuyoshi Aoki |
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| Rok vydání: | 2021 |
| Předmět: |
Optical fiber cable
Materials science Silicon photonics Optical fiber Silicon business.industry Physics::Optics chemistry.chemical_element Substrate (electronics) law.invention chemistry law Wavelength-division multiplexing Optoelectronics Photonics business Nonlinear Sciences::Pattern Formation and Solitons Free-space optical communication |
| Zdroj: | OFC |
| DOI: | 10.1364/ofc.2021.th4a.1 |
| Popis: | We propose a next generation co-packaged substrate using Si photonics dies, a polymer optical waveguide, and a optical connector to achieve beyond 10 Tb/s and WDM optical links. The two micro-mirrors and polymer waveguides were integrated, and their optical characteristics were evaluated. |
| Databáze: | OpenAIRE |
| Externí odkaz: |
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