Process Development of Via Formation by Laser Drilling on Insulating Resin

Autor:	Daniel Ismael Cereno, Chong Ser Choong, Hsiao Hsiang-Yao
Rok vydání:	2022
Zdroj:	2022 IEEE 24th Electronics Packaging Technology Conference (EPTC).
DOI:	10.1109/eptc56328.2022.10013188
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::66273678032bb5fd80b30468d194aba7 https://doi.org/10.1109/eptc56328.2022.10013188 Zobrazit plný text záznamu