10 and 7 μm Pitch Thermo-compression Solder Joint, Using A Novel Solder Pillar And Metal Spacer Process
| Autor: | Ehsan Shafahian, Gerald Beyer, Inge De Preter, Carine Gerets, Eric Beyne, Fumihiro Inoue, Jaber Derakhshandeh, Giovanni Capuz, Julien Bertheau, Andy Miller, Fabrice Duval, Alain Phommahaxay, Pieter Bex, T. Webers, Geert Van der Plas, Stefaan Van Huylenbroeck, Lin Hou, Vladimir Cherman |
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| Rok vydání: | 2020 |
| Předmět: |
010302 applied physics
Materials science Yield (engineering) 020208 electrical & electronic engineering Process (computing) 02 engineering and technology Deformation (meteorology) Compression (physics) 01 natural sciences Metal visual_art Soldering 0103 physical sciences 0202 electrical engineering electronic engineering information engineering visual_art.visual_art_medium Process window Composite material Joint (geology) |
| Zdroj: | 2020 IEEE 70th Electronic Components and Technology Conference (ECTC). |
| Popis: | In this paper, spacer bumps concept is introduced to increase the process window for TCB, lower the sensitivity of electrical yield to bump height variation, maintain the gap between two dies and to prevent too much solder deformation for a test vehicle having multi-diameter bumps from 40um down to 5um pitches. Adding spacer bumps improves the electrical yield dramatically to close to 100% and ensures having good solder joint and IMC formation for both face to face N=2 and back to face N=4 stacks. |
| Databáze: | OpenAIRE |
| Externí odkaz: |
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