Microstructure and physical properties of sputter-deposited Cu-Mo thin films
| Autor: | Imane Souli, Johannes Zechner, Christian Mitterer, Velislava L. Terziyska |
|---|---|
| Rok vydání: | 2018 |
| Předmět: |
010302 applied physics
Materials science Alloy Metals and Alloys 02 engineering and technology Surfaces and Interfaces engineering.material 021001 nanoscience & nanotechnology Microstructure 01 natural sciences Surfaces Coatings and Films Electronic Optical and Magnetic Materials Chemical engineering Sputtering Residual stress Electrical resistivity and conductivity 0103 physical sciences Materials Chemistry engineering Thin film 0210 nano-technology Elastic modulus Solid solution |
| Zdroj: | Thin Solid Films. 653:301-308 |
| ISSN: | 0040-6090 |
| DOI: | 10.1016/j.tsf.2018.03.039 |
| Popis: | Within this work, monolithic Cu-Mo alloy films were grown by d.c. magnetron sputter co-deposition at room temperature and 473 K on Si (100) substrates. The Cu-Mo system was studied within the complete concentration range between pure Cu and pure Mo with steps of ~10 at.%. Depending on growth conditions and composition, metastable Cu-rich or Mo-rich solid solutions in single-phase films rich in either Cu or Mo, respectively, or dual-phase films consisting of both phases for intermediate compositions are formed. The physical properties in terms of residual stress, hardness, elastic modulus and electrical resistivity are correlated with the chemical composition and the microstructure of the films. The formation of either Cu-rich or Mo-rich solid solutions stabilizes the film structure and stress state, while the dual-phase films exhibit a pronounced self-annealing behavior resulting in residual stress release with time. |
| Databáze: | OpenAIRE |
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