Application of an absolute pattern placement measuring tool for wafer metrology

Autor: K. Rinn
Rok vydání: 1994
Předmět:
Zdroj: Microelectronic Engineering. 23:399-402
ISSN: 0167-9317
DOI: 10.1016/0167-9317(94)90182-1
Popis: An absolute pattern placement measuring tool (Leitz LMS 2020) has been used for registration measurements on wafers for characterising stepper performance. The advantages of this approach are discussed, the measurement and evaluation procedure is outlined. Examples of results are presented to characterise both, single stepper performance and overlay between two steppers.
Databáze: OpenAIRE