| Autor: |
Hongseok Kim, Kyung-Nam Lee, Jonghoon J. Kim, Ji-Min Kim, Jong-Hoon Woo, Hyunsuk Lee, Joungho Kim, Dong-Hyun Kim, Hyeok-Cheol Kwon, Hoon Kim, Jung Min Park |
| Rok vydání: |
2016 |
| Předmět: |
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| Zdroj: |
2016 IEEE 25th Conference on Electrical Performance Of Electronic Packaging And Systems (EPEPS). |
| DOI: |
10.1109/epeps.2016.7835442 |
| Popis: |
Different designs of vertical dual port coaxial connectors are proposed and analyzed using full wave 3D simulation tool up to 10 GHz. By inserting conducting grounds around the pins, the signal integrity of the vertical dual port coaxial cable connector is improved. The vertical dual port coaxial connector cable assembly can be used to reduce the printed circuit board space required for the connectors and reduce the total cost of coaxial connectors required for automotive system. |
| Databáze: |
OpenAIRE |
| Externí odkaz: |
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