Principal Pilot Line Manufacturing Challenges and Solutions in Direct Fabrication of a-Si:H TFT Arrays on Flexible Substrates

Autor: Gregory B. Raupp, David R. Allee, Curt Moyer, Shawn M. O¡¯Rourke, Jovan Trujillo, Sameer M. Venugopal, Barry O'Brien, Dirk Bottesch, Douglas E. Loy, Edward J. Bawolek, Michael Marrs, Scott K. Ageno, Jann Kaminski, Rita Cordova, Jeff Dailey
Rok vydání: 2007
Předmět:
Zdroj: MRS Proceedings. 1030
ISSN: 1946-4274
0272-9172
DOI: 10.1557/proc-1030-g07-05
Popis: Principal challenges to direct fabrication of high performance a-Si:H transistor arrays on flexible substrates include automated handling through bonding-debonding processes, substrate-compatible low temperature fabrication processes, management of dimensional instability of plastic substrates, and planarization and management of CTE mismatch for stainless steel foils. In collaboration with our industrial and academic partners, we have developed viable solutions to address these challenges, as described in this paper.
Databáze: OpenAIRE
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