New developed of thin plastic package with high terminal counts
| Autor: | O. Nakagawa, M. Yasunaga, Y. Tsutsumi, Y. Nemoto, S. Nakao, H. Shimamoto, Masanobu Kohara |
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| Rok vydání: | 1990 |
| Předmět: |
Engineering
Interconnection business.industry General Engineering Molding (process) Industrial and Manufacturing Engineering Electronic Optical and Magnetic Materials Dual in-line package Reliability (semiconductor) Chip-scale package Electronic engineering Quad Flat No-leads package Electrical and Electronic Engineering Quad Flat Package Composite material Tape-automated bonding business |
| Zdroj: | IEEE Transactions on Components, Hybrids, and Manufacturing Technology. 13:401-406 |
| ISSN: | 0148-6411 |
| DOI: | 10.1109/33.56175 |
| Popis: | A small and thin quad flat package (QFP)-type plastic package for large-scale integrated (LSI) logic devices with high pin counts has been developed. The size of the package with 252 input and output pins is 17.3 mm by 17.3 mm, and the thickness is 1.52 mm. The pitch and the width of the leads are 0.25 and 0.1 mm, respectively. The main technologies for assembly of the package are tape automated bonding (TAB) interconnection technology, which has been developed for bonding of high-terminal-count LSIs, and the molding technology, which has also been developed for very small and thin plastic packages. The reliability of the package and the outer lead bonding of the package were evaluated, and it was confirmed that both the package and the bonding have no problem in the pressure cooker test (PCT), the temperature cycle test, and the high-temperature-storage test. > |
| Databáze: | OpenAIRE |
| Externí odkaz: |
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