| Popis: |
In this study, we demonstrate the capabilities of lock-in thermography (LIT) for the inspection of sintered chip interconnections. The laser LIT technology is used to detect delamination in the sintered layer between copper pad and SiC chip. This work will present a LIT system for the failure analysis (FA) without spray coating for industrial inspections of electronic components with thin layers, low emissivity surfaces, and high conductivity, which may produce thermal failure contrast even below noise level of the IRcamera systems |
