A Bandwidth-Dense, Low Power Electronic-Photonic Platform and Architecture for Multi-Tbps Optical I/O

Autor:	Evelina Yeung, Chen Sun, Pavan Bhargava, Milos A. Popovic, Derek Van Orden, Roy Meade, Vladimir Stojanovic, Rajeev J. Ram, Marc De Cea Falco, Mark T. Wade, Michael L. Davenport, John M. Fini
Rok vydání:	2018
Předmět:	Interconnection 020210 optoelectronics & photonics Materials science business.industry Laser source Bandwidth (signal processing) 0202 electrical engineering electronic engineering information engineering Silicon on insulator Optoelectronics 02 engineering and technology Photonics business
Zdroj:	ECOC
DOI:	10.1109/ecoc.2018.8535563
Popis:	We present a high bandwidth-density photonic interconnect platform that transmits 1.05 Tbps/mm2 using 0.83 pJ/bit, integrated in a 45nm SOI process, and a high-density multi-wavelength laser source.
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::64645569bf3aad79426291c3903b0631 https://doi.org/10.1109/ecoc.2018.8535563 Zobrazit plný text záznamu