| Autor: |
J. Noiray, J. Mazuir, C. Bouvier, M. Saadaoui, A. Planchais, G. Simon, G. Pares, K. Martinschitz |
| Rok vydání: |
2012 |
| Předmět: |
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| Zdroj: |
2012 IEEE 14th Electronics Packaging Technology Conference (EPTC). |
| DOI: |
10.1109/eptc.2012.6507097 |
| Popis: |
Fan-Out wafer level packaging (eWLP) has been proven to be a valuable solution for producing compact multi-die packages with high performances and is from now on in volume production[1–3]. Known good dies are rebuilt in a molding compound matrix wafer and fan out redistribution layer and bumps are subsequently built on top of the as-formed strata. In this work we present a novel ultra-thin 3D-eWLP technology designed for smart-card products integrating heterogeneous ICs in a three stacked strata architecture. |
| Databáze: |
OpenAIRE |
| Externí odkaz: |
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