A W-Band Micromachined On-Wafer Probe With Integrated Balun for Characterization of Differential Circuits
| Autor: | Robert M. Weikle, Matthew F. Bauwens, Arthur W. Lichtenberger, Chunhu Zhang, N. Scott Barker |
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| Rok vydání: | 2016 |
| Předmět: |
Engineering
Radiation business.industry Amplifier 020208 electrical & electronic engineering Impedance matching 020206 networking & telecommunications 02 engineering and technology Integrated circuit Condensed Matter Physics Characterization (materials science) law.invention W band Balun law 0202 electrical engineering electronic engineering information engineering Scattering parameters Electronic engineering Wafer testing Electrical and Electronic Engineering business |
| Zdroj: | IEEE Transactions on Microwave Theory and Techniques. 64:1585-1593 |
| ISSN: | 1557-9670 0018-9480 |
| DOI: | 10.1109/tmtt.2016.2538760 |
| Popis: | Differential circuits are commonly used for millimeter-wave monolithic integrated circuits such as amplifiers and voltage-controlled oscillators. The infrastructure for their characterization, however, remains limited at these frequencies. With the recent development in micromachined on-wafer probes, a probe integrated with balun circuitry can provide a convenient way to characterize differential integrated circuits. In this paper, a micromachined probe with an integrated balun operating at W-band is demonstrated. The measured S-parameters of the balun probe are in agreement with simulation and meet the design performance requirements. Furthermore, the balun probe design has the potential to be scaled to submillimeter-wave frequencies. |
| Databáze: | OpenAIRE |
| Externí odkaz: |
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