Integrated circuit fabrication compatible three-mask tungsten process for micromotors and gears
| Autor: | Thomas Zettler |
|---|---|
| Rok vydání: | 1994 |
| Předmět: |
Materials science
Fabrication Precision engineering Metals and Alloys Oxide chemistry.chemical_element Nanotechnology Integrated circuit Chemical vapor deposition Tungsten Condensed Matter Physics Surfaces Coatings and Films Electronic Optical and Magnetic Materials law.invention chemistry.chemical_compound chemistry law Miniaturization Electrical and Electronic Engineering Stepper Instrumentation |
| Zdroj: | Sensors and Actuators A: Physical. 44:159-163 |
| ISSN: | 0924-4247 |
| DOI: | 10.1016/0924-4247(94)00799-3 |
| Popis: | A novel process concept for fabrication of gears and electrostatic micromotors is proposed which requires only three mask layers and can be employed in a conventional integrated circuit (IC) manufacturing process as a backend option. The process requires a few additional process steps, namely two sacrificial oxide depositions, two chemical vapour deposition tungsten and adhesion layer depositions, two anisotropic etch steps and one isotropic etch step. The first tungsten deposition forms the bodies of the micromechanical elements, while the second tungsten deposition forms fixing studs. Compared with conventional processes for fabrication of micromotors, the proposed process is superior in simplicity (number of mask layers), efficient use of stepper resolution by improved surface planarity, and compatibility with standard IC technology. Experimental results demonstrate the feasibility of fundamental process steps such as tungsten filling of arbitrary grooves and the mechanical stability of the tungsten elements. |
| Databáze: | OpenAIRE |
| Externí odkaz: |
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