Aluminum pastes (lead-free/low-bow) for thin wafers

Autor:	Aziz S. Shaikh, Chandra Khadilkar, Steve S. Kim, Sid Sridharan
Rok vydání:	2005
Předmět:	Materials science Metallurgy chemistry.chemical_element Sintering law.invention Stress (mechanics) Crystal chemistry Aluminium law Solar cell Metal powder Wafer Layer (electronics)
Zdroj:	Conference Record of the Thirty-first IEEE Photovoltaic Specialists Conference, 2005..
DOI:	10.1109/pvsc.2005.1488327
Popis:	Presently, a typical thickness of the silicon wafer used by the solar cell industries is about 280/spl sim/330 /spl mu/m. The industry trend is to use thinner wafers to reduce the cost of solar cells. The wafer cost is about 60% of the cell fabrication cost. Going-forward industry is targeting thickness of
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::63db7af649bff9d7dba04e63c7eb9e3e https://doi.org/10.1109/pvsc.2005.1488327 Zobrazit plný text záznamu