Pattern Collapse Improvement in ArF Resist: Effect of Surfactant-added Rinse and Soft Bake

Autor:	Hyun-Woo Kim, Myoung-Ho Jung, Han-Ku Cho, Sung-Ho Lee, Sang-Gyun Woo, Woo-Sung Han
Rok vydání:	2003
Předmět:	Spin coating Materials science Polymers and Plastics business.industry Organic Chemistry Relaxation (NMR) engineering.material Surface tension Optics Resist Coating Pulmonary surfactant Materials Chemistry engineering Wafer Composite material business Lithography
Zdroj:	Journal of Photopolymer Science and Technology. 16:463-466
ISSN:	1349-6336 0914-9244
Popis:	In this study, we investigated the effect of surfactant-added rinse and soft bake on pattern collapse in ArF lithography. It was possible to obtain 21% narrower pattern with the aid of surfactant solution. Surfactant with low dynamic surface tension was more effective, so it seems to be required to consider dynamic properties of surfactant when we use spin dry. During the study, we found that pattern collapse occurred much earlier at the edge of wafer and we could decrease the positional difference by increasing bake time or temperature after resist coating. It is supposed that this result come from the relaxation of internal stress induced during spin coating
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::6389c0974a31eda05458e20c7b1ec4e1 https://doi.org/10.2494/photopolymer.16.463 Zobrazit plný text záznamu