A New Fan-Out-Package-Embedded Power Inductor Technology
| Autor: | Xiangming Fang, Rongxiang Wu, Yixiao Ding, Johnny K. O. Sin |
|---|---|
| Rok vydání: | 2020 |
| Předmět: |
010302 applied physics
Dc resistance Materials science business.industry Electrical engineering Fan-out Voltage regulator Inductor 01 natural sciences Die (integrated circuit) Electronic Optical and Magnetic Materials Power (physics) 0103 physical sciences Electrical and Electronic Engineering business Voltage converter |
| Zdroj: | IEEE Electron Device Letters. 41:268-271 |
| ISSN: | 1558-0563 0741-3106 |
| Popis: | In this letter, a fan-out-package-embedded power inductor technology is proposed. The inductor is embedded in a silicon-based fan-out package and surrounds the packaged die in which a voltage converter IC can be put. To demonstrate the integrated power inductor technology, a 2.4-nH air-core inductor for integrated voltage regulator applications is fabricated. The fabricated inductor shows a dc resistance of 5.0 $\text{m}\Omega $ and quality factors of 43–67 in the frequency range of 100–500 MHz. The small dc resistance and high quality factors make this integrated inductor technology promising for integrated power conversion. |
| Databáze: | OpenAIRE |
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